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Film peeling device - メーカー・企業と製品の一覧

Film peeling deviceの製品一覧

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Vertical Manual Mylar Film Peeling Device

Vertical Manual Mylar Film Peeling Device

As an inline device for exposure machines and developing machines! A manual type peeling device that allows for stable static elimination easily.

The "Vertical Manual Mylar Film Peeling Device" is a manual type machine for peeling Mylar film from printed circuit boards' D/F.PSR. It can be used inline with exposure and developing machines. The suction method allows for ON/OFF operation via a foot switch or a toggle switch. It consistently provides stable static elimination, and the filter unit can be easily replaced. The peeling methods include setting the circuit board on a Teflon-coated suction plate to prevent scratches and corrosion, with corner cuts for peeling, or applying adhesive tape to the edges for peeling. 【Features】 ■ Usable inline with exposure and developing machines ■ Suction method with ON/OFF operation via foot switch/toggle switch ■ Consistently stable static elimination ■ Easy replacement of the filter unit *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • others

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Nerlingless Auto Peeler

Nerlingless Auto Peeler

A new technology currently under patent application enables the automatic peeling of difficult-to-remove films such as dry film solder resist, ABF, and dry film resist!

▶ Compatible with various workpieces - Unlike conventional auto peelers, it can peel off high-adhesion films (such as dry film resist, ABF, dry film solder resist, etc.) that are difficult to automatically peel. - It can also accommodate various shapes of workpieces, including ultra-thin films for semiconductors and electronic components, as well as protective films for acrylic and glass. ▶ Compatible with various films - Interlayer insulating materials (such as ABF) - Dry film solder resist (DFSR) - Polyimide films - Other high-adhesion films ▶ Damage reduction - Being burr-free, it reduces film breakage and damage caused by the film. ▶ Clean peeling - Since it does not use air blow, chip flying and dust generation are minimized, resulting in improved yield rates. ▶ Additional options for detection functions available It is possible to detect film breakage and remaining film using sensors or image processing (optional). By adding detection functions, it can further reduce the occurrence of defects and improve yield rates. *Pre-tests using experimental machines are also available before purchase. Please consult us.

  • Printed Circuit Board

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Auto-pillar horizontal device

Auto-pillar horizontal device

Remove Mylar film using Pin and Air! No additional thickness adjustment is needed for each product.

This device is designed to automatically peel off a protective film (Polyester Film) that is tightly adhered to the surface in order to protect the dry film of printed circuit boards before the developing process. It uses a peeling method that employs pins and air to remove the Mylar film. There is no need for separate thickness adjustments for different products, and it allows for section settings tailored to the product size. Additionally, it is a system that does not require periodic replacement of consumables. 【Features】 - No separate thickness adjustments needed for different products - Section settings tailored to product size (3 levels) - A total of 18 film detection sensors (9 each for the upper and lower parts) installed to minimize the defect rate of unpeeled films - A system that does not require periodic replacement of consumables - Applicable range: Inner/Outer layer PCB & FPCB *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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